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- 商品名称:Shinkawa STC-500 贴片机 已停产
- 商品编号:SEMI000106
- 品牌:Shinkawa 新川
- 上架时间:2014-07-10
- 商品毛重:0克
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SPA-300
SPA-400
SPA-500
STC-500
SPA-800LEDThe Shinkawa STC-500 is an automatic die bonder (die attach machine) designed for discrete semiconductor packaging and assembly.
The Shinkawa semiconductor equipment division was integrated into Yamaha Robotics, and production of the STC-500 has officially discontinued. It has since been succeeded by newer-generation models such as the Shinkawa STC-800.
Key Specifications & Features
While specific documentation for the vintage STC-500 is limited due to its legacy status, its architectural lineage shares core features with its successor (the STC-800):
- Application Focus: Engineered specifically for high-volume, automated packaging of discrete semiconductor components (diodes, transistors, small ICs).
- Bonding Method: Utilizes automated thermo-eutectic or epoxy bonding techniques to secure silicon chips onto lead frames.
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